• Size: Maximum <1x2m, substrate stage size can be customized

• Vacuum limit: Better than 5.0x10^-5Pa (glove box environment)

   Pumping speed: atmospheric pressure ~5x10^-4Pa<25min (glove box environment)

• Sputtering target: rectangular target gun, customized according to needs

• Power supply: Equipped with 600w RF power supply and 2kw high-performance DC pulse power supply

• Film thickness uniformity: high film thickness uniformity

• Sputtering materials: ITO, IZ0, IWO, etc.